El1000 hot air leveling flux / tin spray flux

   Product characteristics

 

The flux is a special flux for PCB manufacturing industry. It has excellent properties of assisting the flow of tin liquid. The tin layer is fast, uniform and extremely thin, does not block micropores, and is not easy to produce pinholes to obtain a dense tin layer. The satisfactory effect of tin loading can be obtained at one time without repeated tin spraying, so the work efficiency can be greatly improved. The residual flux after hot melting can be washed away with clear water, which can save a lot of organic solvent for cleaning.
Product advantage

● excellent activity, with specular luster on the tin surface;
● the surface residues after welding can be cleaned with water;
Excellent welding performance, low defect rate, even and smooth tin surface;
The viscosity is moderate, and tin can be sprayed directly without preheating;
● it has good activity and can meet the requirements of one-time tin loading for single / double-sided boards;

 Application scope

    It is widely used in single-layer board, multilayer board vertical or horizontal tin spraying process, double-sided board or single panel with metallized holes manufactured by covering method or plugging method.

 parameter  

  Application Guide

 

1) preparation before welding

In order to obtain stable welding quality and reliable electrical performance, bare copper plate should be coated with flux immediately after pretreatment. The pretreatment is based on the quality of copper plate and the manufacturing process of the manufacturer, but its purpose is to remove the oxide on the copper surface and the residual ink which affect the tin effect.

2) application of flux

The agent can be applied by brushing, spraying, bubbling, rolling and other methods. Ensure that a uniform and dense flux coating is obtained on the copper surface of PCB.

3) recommended process parameters for tin spraying are as follows:
◆ bath temperature: 245 ± 100 ℃
◆ mixing and protection temperature: 245 ± 100 ℃
◆ immersion time: 0.5-4 seconds
◆ blowing pressure: 2.8 ± 0.4 kg / cm2
◆ blade angle: front 3-50; back 5-70
◆ soldering flux immersion time: 30-90 seconds, the best process parameters can also be set according to the tin surface effect required by the manufacturer.
4) post treatment

The post-treatment can be carried out by washing with clear water. After cleaning, follow-up PCB tin spray plate protection or cleaning process can be carried out according to the customer's requirements.