应用领域

锡焊 钎焊 印刷 机加 胶粘 风电叶片 半导体芯片 锂电池

型号 名称 类型 PH 比重
(20℃,g/cm3)
沸点
(℃)
产品特点
EF2000 Tin dipping flux Solvent type Acid 0.801 82 Single-layer board and multi-layer board are welded by hand or wave soldering. It is also suitable for tin dipping process of electronic wires and terminals and integral tin plating process of semi-flexible coaxial cables.
EF3000 High pressure resistant flux Solvent type Acid 0.808 82 Single and double panel process.  It is especially suitable for high voltage power supplies and rectifiers with high insulation requirements.
EF4000 Copper wire tin plating flux Water soluble type Acid 1.06 82 Hot Tin Plating Process for Braided Copper Wire
EF5000 Transformer pin flux Solvent type Acid 0.825 82 It is mainly suitable for dipping tin in the pins of transformers, inductors, network transformers or other components with fewer pins.
EF6000 Pv ribbon flux Solvent type Acid 0.8 82 The pv ribbon is entirely tinned, suitable for high-speed and low-speed machines.
EF8000A Automatic welding flux for photovoltaic module Solvent type Acid 0.796 82 Automatic machine welding of photovoltaic module cells and welding strips.
EF8000 Flux for photovoltaic module Solvent type Acid 0.795 82 Manual welding of photovoltaic module cells and welding strips.
EL1000 Hot air leveling/tin spraying flux Water soluble type Acid 1.07 82 Single-layer board, multi-layer board spraying tin vertically or horizontally.
EP1000 BGA solder paste Solvent type Acid 1.86 82 It is suitable for SMD repair of PCB, BGA and PGA such as mobiles phones, communication and data line.
EF1000 Wash free flux Solvent type Acid 0.805 82 Manual or wave soldering of single and double-sided plates.  It is suitable for low-demand energy-saving lamps and control panels.
ER2000 Lead-free solder paste Solvent type Neutral 4.0-5.5 >140 It is suitable for all kinds of high precision welding in SMT production.
ER1000 Lead solder paste Solvent type Neutral 4.5-5.5 >140 It is completely suitable for SMT surface mounting requirements, especially for the soldering of fine pitch components (QFP, CSP, BGA).
solder wire solder wire NA Neutral NA NA Smooth tin application, less residue and less odor
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